Rephonic
Artwork for 3D IC
3D IC
Chiplets
Siemens
Three-Dimensional Integrated Circuits
Crypto Quantique
Hierarchical Device Planning
Trusted Computing Group
Hardware Security
Siemens EDA
CTE (coefficient Of Thermal Expansion)
Thermal Management
Intel
Test Vehicle
2.5D/3D Packaging
SIPI
Alphawave Semi
Interposers
EDA Tools
Package Design Complexity
Daisy Chain

As the semiconductor industry struggles with the limits of Moore’s Law, traditional monolithic scaling is no longer enough to meet performance, power, area and cost demands in technology, design, analysis, and manufacturing. 3D IC by Siemens is your go-to podcast for exploring the cutting-edge world of 3D IC packaging—a revolutionary approach reshaping semiconductor design, system integration, and... more

PublishesWeeklyEpisodes24Founded4 years ago
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Artwork for 3D IC

Latest Episodes

What can AI actually do in 3D IC design today — and what's still science fiction?

What you’ll learn…

(01:25) Sudarshan's role leading global 3D IC software R&D at Siemens

(02:30) The real starting challenges of 3D IC design — and why there's no pl... more

YouTube

What happens when a single untracked design change turns into a multi-billion-dollar public scandal?

What you’ll learn...

(00:00) Why data — not just design — is the hidden challenge behind every 3D IC

(01:55) A real-world case study: how poor tra... more

YouTube

What does it take to build a chip when the chip itself is an ecosystem — and the wire connecting everything has become the biggest bottleneck in modern semiconductors?

What you’ll learn...

(00:56) Bob's background and the founding of NHanced Semico... more

YouTube

What does it take for one of the world's most complex engineering organisations to commit — fully — to 3D IC as a strategic direction? And what does that commitment reveal about the gaps the entire industry still needs to close?

What you’ll learn...... more

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Recent Guests

Bob Patti
President and CEO of Enhanced Semiconductors
Enhanced Semiconductors
Episode: The Wire Problem: Why Advanced Packaging Is the Only Answer Left as Moore's Law Runs Out
Sujit Sharan
Intel Fellow in Advanced Packaging Technology Manufacturing Organization
Intel Corporation
Episode: From Silos to System: Sujit Sharan on the Cultural and Technical Shift 3D IC Demands
Andras Vass-Varnai
Solution Architect for 3D IC Reliability at Siemens EDA
Siemens EDA
Episode: The Hidden Time Bomb: Engineering Reliability Into 3D IC From Day One
Chris Jones
Representative from Crypto Quantique, hardware security expert
Crypto Quantique
Episode: Zero Trust in Silicon: The New Security Imperative for Chiplet-Based 3D ICs
Archana Cheruliyil
Connectivity IP expert from Alphawave Semi (Qualcomm company)
Alphawave Semi
Episode: Beyond the Data Pipe: Why Connectivity IP Is Now the System-Critical Layer in Every 3D IC
Kevin Rinebold
3D IC packaging and account technology manager and co-design expert
Siemens EDA
Episode: From 2.5D to True 3D IC: What’s Driving the Next Wave of Integration
Kendall Hiles
Senior 3D IC product specialist at Siemens EDA
Siemens EDA
Episode: Why Every 3D IC Needs a Test Vehicle Before It Hits Production
Per Viklund
Director IC Packaging and RF Product Lines at Siemens EDA
Siemens EDA
Episode: Breaking Down 50 Million Pins: A Smarter Way to Design 3D IC Packages
John Caka
Principal SIPI engineer at Siemens EDA
Siemens EDA
Episode: Why SI/PI is Mission-Critical for 3D IC Success

Hosts

Tova Levy
Host of the podcast
John McMillan
Host of the Siemens 3D IC Podcast series

Chart Rankings

How this podcast ranks in the Apple Podcasts, Spotify and YouTube charts.

Apple Podcasts
#49
Israel/News/Tech News
Apple Podcasts
#58
South Korea/News/Tech News
Apple Podcasts
#111
India/News/Tech News
Apple Podcasts
#140
Taiwan/News/Tech News
Apple Podcasts
#188
Japan/News/Tech News

Talking Points

Recent interactions between the hosts and their guests.

From 2.5D to True 3D IC: What’s Driving the Next Wave of Integration
Q: What are some of the methodology changes that are needed to enable successful 3D IC development?
Methodology changes involve adopting a system-centric mindset from early floorplanning through sign-off, modeling power and thermal holistically, and implementing shift-left predictive analytics to evaluate multiple design scenarios in parallel, supported by cross-disciplinary collaboration and a broader toolchain capable of handling 3D-specific verification and integration challenges.
From 2.5D to True 3D IC: What’s Driving the Next Wave of Integration
Q: In conversations with customers, what do you see as the tipping point that sends them over to 3D IC design?
The tipping point is a mix of economic and technical factors: escalating non-recurring engineering costs for future nodes, the demand for large memory bandwidth and low latency, and the realization that combining compute cores with memory and interposers in a 3D stack can provide a more cost-effective path than pushing to ever smaller nodes.
From 2.5D to True 3D IC: What’s Driving the Next Wave of Integration
Q: In today's podcast, we're gonna take a deep dive into 3D IC design and the mindset and what the next wave of 3D IC integration looks like. What are you seeing as the tipping point for customers to move to 3D IC design?
Customers move toward 3D IC when they recognize the combination of access to high-bandwidth memory, the ability to keep costs in check by integrating smaller, optimized IP blocks, and the need to manage performance, power, and thermal constraints that traditional monolithic scaling can no longer meet.
Why SI/PI is Mission-Critical for 3D IC Success
Q: Got it. Switching gears, who are the key stakeholders involved in a 3D IC design and why is cross-team collaboration so critical?
Key stakeholders include system architects, dye designers, layout teams, and SIPI analysts. Collaboration is essential because decisions in one area (like power integrity or PDN design) impact others (such as floor planning and interposer strategy), and early alignment helps manage multi-physics challenges and packaging constraints.
Why Every 3D IC Needs a Test Vehicle Before It Hits Production
Q: How do test vehicles affect the OSAT-OEM relationship and the broader supply chain?
Test vehicles serve as a critical shared validation tool, with OSATs, OEMs, and customers each using them to verify manufacturing viability, isolate issues early, and align on process capabilities before committing to large-scale production.

Audience Metrics

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Frequently Asked Questions About 3D IC

What is 3D IC about and what kind of topics does it cover?

The show centers on advanced semiconductor packaging and integration, with a strong focus on 2.5D/3D IC architectures, chiplets, interposers, and high-bandwidth memory. Episodes typically feature deep dives into reliability, signal and power integrity, test vehicles, security, and ecosystem enablement, often framed around practical design workflows, industry standards, and toolchain collaboration with EDA providers. A notable strength is the pragmatic, multi-disciplinary approach that pairs technical depth with cross-domain perspectives—from silicon design to packaging, test, and security—often highlighting real-world challenges, standardization efforts, and the economics of next‑generation packaging. The format tends to combine expert inte... more

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1. OnTrack: The PCB Design Podcast
2. Economist Podcasts
3. All-In with Chamath, Jason, Sacks & Friedberg
4. Freakonomics Radio
5. Page 94: The Private Eye Podcast

How many episodes of 3D IC are there?

3D IC launched 4 years ago and published 24 episodes to date. You can find more information about this podcast including rankings, audience demographics and engagement in our podcast database.

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What guests have appeared on 3D IC?

Recent guests on 3D IC include:

1. Bob Patti
2. Sujit Sharan
3. Andras Vass-Varnai
4. Chris Jones
5. Archana Cheruliyil
6. Kevin Rinebold
7. Kendall Hiles
8. Per Viklund

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