Rephonic
Artwork for 3D IC
3D IC
Chiplets
Siemens
Siemens EDA
Three-Dimensional Integrated Circuits
Artificial Intelligence
Crypto Quantique
Hierarchical Device Planning
Trusted Computing Group
Hardware Security
CTE (coefficient Of Thermal Expansion)
Thermal Management
Intel
Data Management
Test Vehicle
2.5D/3D Packaging
SIPI
Alphawave Semi
Interposers
EDA Tools

As the semiconductor industry struggles with the limits of Moore’s Law, traditional monolithic scaling is no longer enough to meet performance, power, area and cost demands in technology, design, analysis, and manufacturing. 3D IC by Siemens is your go-to podcast for exploring the cutting-edge world of 3D IC packaging—a revolutionary approach reshaping semiconductor design, system integration, and... more

PublishesWeeklyEpisodes25Founded5 years ago
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Artwork for 3D IC

Latest Episodes

From AI accelerators to automotive silicon, what does it actually take — organizationally, economically, and technically — to make 3D IC work in the real world?

What you’ll learn...

(01:59) What's already shipping: real-world 2.5D and 3D IC product... more

What can AI actually do in 3D IC design today — and what's still science fiction?

What you’ll learn…

(01:25) Sudarshan's role leading global 3D IC software R&D at Siemens

(02:30) The real starting challenges of 3D IC design — and why there's no pl... more

YouTube

What happens when a single untracked design change turns into a multi-billion-dollar public scandal?

What you’ll learn...

(00:00) Why data — not just design — is the hidden challenge behind every 3D IC

(01:55) A real-world case study: how poor tra... more

YouTube

What does it take to build a chip when the chip itself is an ecosystem — and the wire connecting everything has become the biggest bottleneck in modern semiconductors?

What you’ll learn...

(00:56) Bob's background and the founding of NHanced Semico... more

YouTube

Key Facts

Accepts Guests
Contact Information
Podcast Host

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Recent Guests

Piyush Sancheti
VP Central Engineering Group at Siemens EDA
Siemens EDA
Episode: Nothing's for Free: Piyush Sancheti on the Real Trade-Offs Behind 3D IC Adoption
Sudarshan Deo
Software Engineering Manager for 3D IC at Siemens
Siemens
Episode: From Hype to Engineering: How AI Actually Works in 3D IC design
Vishal Moondhra
VP of Solutions at Perforce Software
Perforce Software
Episode: Beyond the Silo: Managing Data at the Speed of 3D IC Design
Bob Patti
President and CEO of Enhanced Semiconductors
Enhanced Semiconductors
Episode: The Wire Problem: Why Advanced Packaging Is the Only Answer Left as Moore's Law Runs Out
Sujit Sharan
Intel Fellow in Advanced Packaging Technology Manufacturing Organization
Intel Corporation
Episode: From Silos to System: Sujit Sharan on the Cultural and Technical Shift 3D IC Demands
Andras Vass-Varnai
Solution Architect for 3D IC Reliability at Siemens EDA
Siemens EDA
Episode: The Hidden Time Bomb: Engineering Reliability Into 3D IC From Day One
Chris Jones
Representative from Crypto Quantique, hardware security expert
Crypto Quantique
Episode: Zero Trust in Silicon: The New Security Imperative for Chiplet-Based 3D ICs
Archana Cheruliyil
Connectivity IP expert from Alphawave Semi (Qualcomm company)
Alphawave Semi
Episode: Beyond the Data Pipe: Why Connectivity IP Is Now the System-Critical Layer in Every 3D IC
Kevin Rinebold
3D IC packaging and account technology manager and co-design expert
Siemens EDA
Episode: From 2.5D to True 3D IC: What’s Driving the Next Wave of Integration

Hosts

Tova Levy
Host of the podcast
John McMillan
Host of the Siemens 3D IC Podcast series

Chart Rankings

How this podcast ranks in the Apple Podcasts, Spotify and YouTube charts.

Apple Podcasts
#74
South Korea/News/Tech News
Apple Podcasts
#158
Singapore/News/Tech News
Apple Podcasts
#188
Israel/News/Tech News
Apple Podcasts
#215
India/News/Tech News
Apple Podcasts
#227
Taiwan/News/Tech News

Talking Points

Recent interactions between the hosts and their guests.

Nothing's for Free: Piyush Sancheti on the Real Trade-Offs Behind 3D IC Adoption
Q: When does ROI make sense and how should a company decide to go 3D IC or not?
The decision is an economic one as well as a technological choice. There are two main pathways: deciding whether to adopt 3D IC at all, and then choosing between 2.5D versus full 3D stacks based on end-market drivers, with AI and HPC favoring higher performance while consumer and automotive segments weigh cost and complexity.
Nothing's for Free: Piyush Sancheti on the Real Trade-Offs Behind 3D IC Adoption
Q: What have early adopters learned from shipping 3D ICs today?
Early adopters have learned that linear, monolithic SOC design flows don't scale for 3D ICs. Electrical and multi-physics considerations become significantly more demanding, requiring tighter integration of chip and package design, more proactive design planning, and a broader ecosystem of chipmakers, packaging houses, and foundries to achieve manufacturability and cost targets.
Beyond the Silo: Managing Data at the Speed of 3D IC Design
Q: So to get an idea of what can happen when the right data management systems are not in place, can you share a real world example of what can go wrong?
A major chip product company shipped a flagship device with a known security flaw in certain variants, but lacking proper traceability they couldn't identify which fielded chips needed the fix, applying a blanket workaround that slowed down unaffected variants and caused a public relations and market-cap impact; this highlighted the need for precise traceability and selective updates.
From 2.5D to True 3D IC: What’s Driving the Next Wave of Integration
Q: What are some of the methodology changes that are needed to enable successful 3D IC development?
Methodology changes involve adopting a system-centric mindset from early floorplanning through sign-off, modeling power and thermal holistically, and implementing shift-left predictive analytics to evaluate multiple design scenarios in parallel, supported by cross-disciplinary collaboration and a broader toolchain capable of handling 3D-specific verification and integration challenges.
From 2.5D to True 3D IC: What’s Driving the Next Wave of Integration
Q: In conversations with customers, what do you see as the tipping point that sends them over to 3D IC design?
The tipping point is a mix of economic and technical factors: escalating non-recurring engineering costs for future nodes, the demand for large memory bandwidth and low latency, and the realization that combining compute cores with memory and interposers in a 3D stack can provide a more cost-effective path than pushing to ever smaller nodes.

Audience Metrics

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Frequently Asked Questions About 3D IC

What is 3D IC about and what kind of topics does it cover?

The show centers on advanced semiconductor packaging and integration, with a strong focus on 2.5D/3D IC architectures, chiplets, interposers, and high-bandwidth memory. Episodes typically feature deep dives into reliability, signal and power integrity, test vehicles, security, and ecosystem enablement, often framed around practical design workflows, industry standards, and toolchain collaboration with EDA providers. A notable strength is the pragmatic, multi-disciplinary approach that pairs technical depth with cross-domain perspectives—from silicon design to packaging, test, and security—often highlighting real-world challenges, standardization efforts, and the economics of next‑generation packaging. The format tends to combine expert inte... more

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1. The Amp Hour

How many episodes of 3D IC are there?

3D IC launched 5 years ago and published 25 episodes to date. You can find more information about this podcast including rankings, audience demographics and engagement in our podcast database.

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What guests have appeared on 3D IC?

Recent guests on 3D IC include:

1. Piyush Sancheti
2. Sudarshan Deo
3. Vishal Moondhra
4. Bob Patti
5. Sujit Sharan
6. Andras Vass-Varnai
7. Chris Jones
8. Archana Cheruliyil

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