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3D InCites Podcast

Francoise von Trapp
Advanced Packaging
Semiconductor Manufacturing
Semiconductor Equipment
Semiconductor
IMAPS Symposium 2024
Heterogeneous Integration
Chips Act
Sustainability
Underfill
CHIPS and Science Act
Advanced Packaging Technologies
Workforce Development
Metrology
U.S. Chips Act
Semiconductor Supply Chain
PFAS
Boston
Career Opportunities
Networking Opportunities
Electronics Packaging

As a semiconductor industry community, 3D InCites brings to life the people, the personalities, and the minds behind heterogeneous integration and related technologies in a uniquely personal way. The goal is to inform key decision-makers about progress in technology development, design, standards, infrastructure, and implementation.The 3D InCites Podcast provides a forum for our community members ... more

PublishesWeeklyEpisodes178Founded4 years ago
Number of ListenersCategories
BusinessMarketingTechnology

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Latest Episodes

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We record live at IMAPS to follow a first-time attendee’s leap into advanced packaging and a trio of high school students discovering semiconductors, robotics, and career paths that bridge disciplines. Along the way, we unpack speed-t... more

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We sit down with Dr. Subu Iyer of UCLA to unpack chiplets vs dielets, why a universal ecosystem is missing, and how sub‑10 µm bump pitch could make protocols optional. Then we host a panel featuring John Knickerbocker, IBM; Mike Kelly... more

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A semiconductor wafer travels around the globe five times on average before becoming the chip in your smartphone. Each journey represents a potential risk to device reliability that few consumers—or even industry professionals—ever co... more

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SEMI's flagship event, SEMICON West, is moving to Phoenix, Arizona this October 7-9, 2025, after 35 years in San Francisco, coinciding with the region's semiconductor manufacturing boom and $200 billion in announced investments. In th... more

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The IMAPS International Symposium returns to the Town & Country Resort in San Diego from September 29-October 2, 2024, featuring restructured technical tracks, new Monday panel discussions, and exciting networking events including a s... more

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X-ray technology reveals what the naked eye cannot see - the intricate world of semiconductor interconnects that power our digital lives. In this deep dive with Ben Peecock, Senior Director of Business Development at Nordson Test and ... more

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Thailand is positioning itself as a new hotspot for semiconductor and microelectronics manufacturing, building on existing infrastructure and establishing key partnerships throughout the region. Managing editor Jillian McNichol shares... more

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The race toward more powerful AI carries a hidden cost that's becoming impossible to ignore: skyrocketing energy consumption. Did you know AI is projected to devour 10% of global electricity by 2030? This staggering figure has even fo... more

Key Facts

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Recent Guests

Erica Folk
Outgoing President of IMAPS
IMAPS
Episode: San Diego Calling: Your Complete Guide to the IMAPS Symposium
Ben Peecock
Senior Director of Business Development at Nordson Test and Inspection with over 29 years of experience in the field.
Nordson Test and Inspection
Episode: Beyond Silicon: The Power of X-Ray Metrology in Advanced Packaging
Pratyush Kamal
Director of Central Engineering Solutions at Siemens Digital Industries Software
Siemens Digital Industries Software
Episode: From Tape-Out to Co-Design: The Evolution of 3DIC Technologies
Andrew Mathers
Principal Product Line Manager at Nordson Test and Inspection
Nordson Test and Inspection
Episode: Revolutionizing Semiconductor Quality: The Dynamic Planar CT Advantage
Tim Hancock
Principal Technical Fellow for Raytheon, Director of Microelectronics Initiatives
Raytheon
Episode: The Wireless Golden Gateway: Why Advanced Packaging Professionals Should Attend IMS 2025
Jim Buckwalter
Professor of Electrical and Computer Engineering at UC Santa Barbara, founder and CTO of Pseudolithic
University of California, Santa Barbara; Pseudolithic
Episode: The Wireless Golden Gateway: Why Advanced Packaging Professionals Should Attend IMS 2025
Bryan Schackmuth
Senior Product Line Manager for Acoustic Products at Nordson Test and Inspection
Nordson Test and Inspection
Episode: Acoustic Inspection: The Key to Semiconductor Reliability
David Wang
CEO of ACM Research, founder of the company and responsible for general management.
ACM Research
Episode: Chip Champions: How The 3D InCites Award Winners Are Revolutionizing Heterogeneous Integration
SallyAnn Henry
Chief Technologist outside of Asia at ACM Research with over 40 years in the industry.
ACM Research
Episode: Chip Champions: How The 3D InCites Award Winners Are Revolutionizing Heterogeneous Integration

Host

Françoise von Trapp
Host of discussions focused on semiconductor innovations, market trends, and technological advancements, bringing personal insights from industry leaders.

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Talking Points

Recent interactions between the hosts and their guests.

From Tape-Out to Co-Design: The Evolution of 3DIC Technologies
Q: What do end devices mean for EDA at a fundamental level?
The end devices create an expectation of higher performance and lower costs that must be met while managing the complexities of modern chip design.
From Tape-Out to Co-Design: The Evolution of 3DIC Technologies
Q: What has driven the evolution from manual chip design to automation?
The transition was driven by the need for scalability as design complexity increased, ultimately leading to the development of EDA tools that manage integration and efficiency.
From Tape-Out to Co-Design: The Evolution of 3DIC Technologies
Q: Can you tell me a little bit about your background and your current role at Siemens?
Pratyush shares that he joined Siemens two years ago, initially as a contractor working on government projects, and now is the Director of Central Engineering Solutions focusing on 3D ICs.
The AI Revolution: Energy, Ethics, and Advanced Packaging
Q: What do these AMD need from the advanced packaging community to solve these challenges that you talked about in your talk?
Naffziger mentions the need for advancements in thermal management, power efficiency, and close connectivity to optimize AI performance.
The AI Revolution: Energy, Ethics, and Advanced Packaging
Q: Can you just share a little bit about your background and your role there?
Sam Naffziger discusses his background in microprocessor design and leading efforts on power efficiency and chiplet architecture at AMD.

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Frequently Asked Questions About 3D InCites Podcast

What is 3D InCites Podcast about and what kind of topics does it cover?

Focusing on the semiconductor industry, this podcast examines critical advancements and issues in heterogeneous integration and related technologies, often through interviews with key figures within the community. Topics range from the latest technological developments and market trends to strategies for addressing challenges faced by businesses in the sector. Noteworthy episodes delve into events like the IMAPS Symposium and SEMICON West, underscoring the podcast's commitment to informing industry decisions and fostering collaboration among professionals.

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These podcasts share a similar audience with 3D InCites Podcast:

1. Morning Brew Daily
2. The Circuit
3. Pivot

How many episodes of 3D InCites Podcast are there?

3D InCites Podcast launched 4 years ago and published 178 episodes to date. You can find more information about this podcast including rankings, audience demographics and engagement in our podcast database.

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What guests have appeared on 3D InCites Podcast?

Recent guests on 3D InCites Podcast include:

1. Erica Folk
2. Ben Peecock
3. Pratyush Kamal
4. Andrew Mathers
5. Tim Hancock
6. Jim Buckwalter
7. Bryan Schackmuth
8. David Wang

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